| US 7,343,072 B2 | ||
| Light modulator package having inclined light transmissive lid | ||
| Yeong Gyu Lee, Gyeonggi-do (Korea, Republic of); Dong Ho Shin, Seoul (Korea, Republic of); Heung Woo Park, Seoul (Korea, Republic of); Jun Won An, Gyeonggi-do (Korea, Republic of); and Yurlov Victor, Gyeonggi-do (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics, Co., Ltd., Kyunggi-Do (Korea, Republic of) | ||
| Filed on Oct. 06, 2005, as Appl. No. 11/244,769. | ||
| Claims priority of application No. 10-2004-0080489 (KR), filed on Oct. 08, 2004. | ||
| Prior Publication US 2006/0078256 A1, Apr. 13, 2006 | ||
| Int. Cl. G02B 6/32 (2006.01); G02B 6/26 (2006.01) | ||
| U.S. Cl. 385—49 [385/39; 385/33; 385/31; 385/15] | 5 Claims |
| 1. A light modulator package, comprising:
a substrate;
a light modulating device comprising a plurality of light modulating elements provided on the substrate, and reflecting or
diffracting incident light;
a joint layer provided on the substrate to surround the light modulating device;
a light transmissive lid attached to the joint layer such that an outer surface of the light transmissive lid is inclined
relative to a reflective surface of the light modulating elements of the light modulating device, and covering the light modulating
elements; and
wherein at least one of the plurality of the light modulating elements comprises a mirror layer and a piezoelectric layer
operable to shrink and expand to move the mirror layer toward and away from the inclined light transmissive lid during actuation
of the light modulating device.
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