| US 7,502,658 B1 | ||
| Methods of fabricating optimization involving process sequence analysis | ||
| Steven G. Barbee, Dover Plains, N.Y. (US); Jeong W. Nam, Poughquag, N.Y. (US); Viorel Ontalus, Danbury, Conn. (US); and Yuusheng Song, Poughkeepsie, N.Y. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Feb. 19, 2008, as Appl. No. 12/33,502. | ||
| Int. Cl. G06F 19/00 (2006.01) | ||
| U.S. Cl. 700—109 [700/51; 702/82; 702/84] | 2 Claims |
| 1. A method for performing fabrication sequence analysis, the method comprising:
defining a process group, wherein a process group includes fabrication processes in a fabrication sequence;
determining fabrication process paths in the process group to define independent variables, wherein a process path is a plurality
of fabrication equipment used to fabricate a particular semiconductor device in the fabrication sequence;
receiving a dependent variable for the fabrication sequence;
performing analysis of variance to calculate a p-value for the process group;
determining whether the p-value is lower than a threshold value;
identifying a poor process path responsive to determining that the p-value is lower than a threshold value;
outputting the identified poor process path;
determining whether the dependent variable is a parametric value;
calculating Cpk values, wherein
 and USL is an upper specification limit, LSL is a lower specification limit, mean is an average value of the parametric variable
for the process path, and σ is a standard deviation of the parametric variable for the process path; and
identifying a process path having a lowest Cpk value as the poor process path.
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