US 7,502,042 B2
Laser diode thermal transfer printhead
Mark Hitz, Enterprise, Fla. (US); George Vazac, Apopka, Fla. (US); and William Bouverie, Windermere, Fla. (US)
Assigned to Datamax Corporation, Orlando, Fla. (US)
Filed on May 22, 2006, as Appl. No. 11/438,490.
Claims priority of provisional application 60/682896, filed on May 20, 2005.
Prior Publication US 2007/0257981 A1, Nov. 08, 2007
Int. Cl. B41J 2/315 (2006.01)
U.S. Cl. 347—171 15 Claims
OG exemplary drawing
 
1. A thermal transfer printhead comprising:
a backplane including at least one connector receptacle;
a plurality of modules each of which includes a connector adapted to interface with the at least one connector receptacle and a laser diode array having a plurality of laser diodes, each of the laser diodes adapted to project a channel onto a print media, wherein the at least one module interfaces with the backplane at a predetermined angle with respect to a printing direction and pitch to project a predetermined number of channels per unit of spacing of the print media.