| US 7,501,910 B2 | ||
| Signal transmission circuit, IC package, and mounting board | ||
| Keitaro Yamagishi, Tokyo (Japan); and Seiichi Saito, Tokyo (Japan) | ||
| Assigned to Mitsubishi Denki Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Feb. 23, 2006, as Appl. No. 11/359,510. | ||
| Claims priority of application No. 2005-051515 (JP), filed on Feb. 25, 2005; and application No. 2006-045521 (JP), filed on Feb. 22, 2006. | ||
| Prior Publication US 2006/0197679 A1, Sep. 07, 2006 | ||
| Int. Cl. H01P 1/26 (2006.01) | ||
| U.S. Cl. 333—22R [326/30] | 1 Claim |
| 1. A signal transmission circuit, comprising:
a first transmission path having a first impedance;
a terminating resistor having a predetermined resistance; and
a second transmission path having a second impedance, one end of which is connected to the first transmission path, the other
end of which is connected to the terminating resistor, the second impedance being higher than both of the first impedance
and the predetermined resistance,
wherein a signal is received at a connection portion of the first transmission path and the second transmission path, and
wherein the second transmission path has the second impedance which is 1.1 to 4 times of the first impedance, and has a length
corresponding to a delay time which is in a range of from 1.1 times to 2 times of a cycle of the operating frequency.
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