| US 7,501,697 B2 | ||
| Integrated circuit package system | ||
| Choong Bin Yim, Seongnam-si (Korea, Republic of); Hyeog Chan Kwon, Seoul (Korea, Republic of); and Jong-Woo Ha, Seoul (Korea, Republic of) | ||
| Assigned to Stats Chippac Ltd., Singapore (Singapore) | ||
| Filed on Mar. 17, 2006, as Appl. No. 11/276,946. | ||
| Prior Publication US 2007/0216010 A1, Sep. 20, 2007 | ||
| Int. Cl. H01L 23/02 (2006.01); H01L 23/28 (2006.01) | ||
| U.S. Cl. 257—686 [257/784; 257/723; 257/787; 257/E23.141] | 9 Claims |
| 1. An integrated circuit package system comprising:
forming a carrier having a top side and a bottom side;
forming an edge terminal pad on the top side and an inner terminal pad on the bottom side;
connecting an integrated circuit die to an inner portion of the edge terminal pad;
encapsulating the integrated circuit die and the inner portion of the edge terminal pad with the outer portion of the edge
terminal pad exposed and forming an interposer having a boundary terminal pad and an interior terminal pad;
mounting the interposer on the integrated circuit die;
connecting the boundary terminal pad to the inner portion of the edge terminal pad; and
encapsulating the interposer with the interior terminal pad exposed.
|