| US 7,501,656 B2 | ||
| Light emitting diode package with diffuser and method of manufacturing the same | ||
| Seong Yeon Han, Suwon (Korea, Republic of); Seon Goo Lee, Gunpo (Korea, Republic of); Chang Ho Song, Seoul (Korea, Republic of); Jung Kyu Park, Seoul (Korea, Republic of); Young Sam Park, Seoul (Korea, Republic of); and Kyung Taeg Han, Hwasung (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyungki-do (Korea, Republic of) | ||
| Filed on Jul. 25, 2006, as Appl. No. 11/491,947. | ||
| Claims priority of application No. 10-2005-0067859 (KR), filed on Jul. 26, 2005. | ||
| Prior Publication US 2007/0045644 A1, Mar. 01, 2007 | ||
| Int. Cl. H01L 27/15 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2006.01) | ||
| U.S. Cl. 257—79 [257/98; 257/E33.001] | 6 Claims |
| 1. A light emitting diode package comprising:
a substrate with an electrode formed thereon;
a light emitting diode chip mounted on the substrate;
an encapsulant applied around the light emitting diode chip, the encapsulant containing a diffuser; and
a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle,
whereby light from the light emitting diode chip is emitted out of the package without distortion.
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