| US 7,501,153 B2 | ||
| Alkoxide compound, thin film-forming material and method for forming thin film | ||
| Naoki Yamada, Tokyo (Japan); and Atsushi Sakurai, Tokyo (Japan) | ||
| Assigned to Adeka Corporation, Tokyo (Japan) | ||
| Appl. No. 11/665,833 PCT Filed Oct. 05, 2005, PCT No. PCT/JP2005/018445 § 371(c)(1), (2), (4) Date Apr. 20, 2007, PCT Pub. No. WO2006/043418, PCT Pub. Date Apr. 27, 2006. |
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| Claims priority of application No. 2004-306777 (JP), filed on Oct. 21, 2004; and application No. 2004-343513 (JP), filed on Nov. 29, 2004. | ||
| Prior Publication US 2008/0085365 A1, Apr. 10, 2008 | ||
| Int. Cl. C23C 16/00 (2006.01); C09D 1/00 (2006.01) | ||
| U.S. Cl. 427—248.1 [427/255.28; 106/287.18; 106/286.3] | 13 Claims |

1. An alkoxide compound represented by general formula (I) below:
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