| US 7,500,308 B2 | ||
| Method of detaching electronic component from printed circuit board | ||
| Mitsuo Suehiro, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Jan. 16, 2003, as Appl. No. 10/345,351. | ||
| Application 10/345351 is a division of application No. 09/536993, filed on Mar. 29, 2000, granted, now 6,670,556. | ||
| Claims priority of application No. 11-247121 (JP), filed on Sep. 01, 1999. | ||
| Prior Publication US 2003/0173109 A1, Sep. 18, 2003 | ||
| Int. Cl. H05K 3/34 (2006.01) | ||
| U.S. Cl. 29—840 [29/842; 257/778] | 2 Claims |
| 1. A method of detaching an electronic component from a printed circuit board, comprising:
heating a solder bump to a melting temperature between the electronic component and the printed circuit board, said solder
bump having a constriction standing on a surface of a conductive pad on the printed circuit board;
holding an insulated film superposed on the conductive pad, the insulated film defining a through hole receiving the solder
bump inside to form the constriction in the solder bump;
sliding the insulated film along the conductive pad so as to wipe the solder bump from the conductive pad when the solder
bump is kept at the melting temperature; and
lifting up the electronic component from the printed circuit board along with the solder bump after the insulated film has
been slid.
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