| US 7,500,305 B2 | ||
| Placement system for populating a substrate with electronic components | ||
| Jürgen Högerl, Regensburg (Germany); Jens Pohl, Bernhardswald (Germany); Uta Sasse, Feldkirchen-Westerham (Germany); and Ingo Wennemuth, München (Germany) | ||
| Assigned to Qimonda AG, Munich (Germany) | ||
| Filed on Feb. 07, 2006, as Appl. No. 11/348,762. | ||
| Application 11/348762 is a division of application No. 10/700087, filed on Nov. 03, 2003, granted, now 7,069,647. | ||
| Application 10/700087 is a continuation of application No. PCT/DE02/01523, filed on Apr. 25, 2002. | ||
| Claims priority of application No. 101 21 578 (DE), filed on May 03, 2001. | ||
| Prior Publication US 2006/0123624 A1, Jun. 15, 2006 | ||
| Int. Cl. B23P 19/00 (2006.01) | ||
| U.S. Cl. 29—740 [29/700] | 18 Claims |
| 1. A placement system for populating a substrate with at least one electronic component of a semiconductor wafer divided into
electronic components, the placement system comprising:
a substrate holding device for receiving the substrate;
a wafer holding device disposed above said substrate holding device and adapted to receive a wafer holding frame;
said substrate holding device and said wafer holding device being disposed to be positioned with respect to one another horizontally
in an X direction and a Y direction;
a vacuum forceps holding device disposed above said wafer holding device, said vacuum forceps holding device having a vacuum
forceps, which can be finely adjusted in the X direction and the Y direction with regard to said substrate holding device
and disposed to be rotatable and finely adjustable about a Z axis extending in a Z direction; and
said vacuum forceps holding device being configured to move said vacuum forceps, in a region of said wafer holding frame,
vertically in the Z direction into a rest position, into a preliminary position, and into a mounting position.
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