| US 7,339,792 B2 | ||
| Graphics card apparatus with improved heat dissipating assemblies | ||
| Tai-Sheng (Andrew) Han, Fullerton, Calif. (US) | ||
| Assigned to EVGA Corporation, Brea, Calif. (US) | ||
| Filed on Dec. 14, 2005, as Appl. No. 11/304,169. | ||
| Prior Publication US 2007/0133178 A1, Jun. 14, 2007 | ||
| Int. Cl. H05K 7/20 (2006.01) | ||
| U.S. Cl. 361—719 [361/695; 361/698; 361/700; 165/80.3; 165/80.4; 165/80.5; 165/104.33] | 18 Claims |

| 1. A graphics card apparatus with improved heat dissipation, comprising:
a metal block thermally coupled to one or more electronic components of said graphics card apparatus and including a tubing
forming a tortuous passage for fluid therewithin, said tubing having an inlet end and an exit end;
a radiator including a pipe having an inlet end and an exit end and baffles thermally coupled to said pipe, the inlet end
of said pipe being connected to the exit end of said tubing;
a pump having a first and second ports respectively connected to the inlet end of said tubing and the exit end of said pipe,
said pump being operative to circulate coolant through said pipe and said tubing and thereby to transfer thermal energy from
said metal block to said radiator;
a first fan for generating an air flow and a first carrier for said first fan; and
an enclosure surrounding said radiator, metal block, first fan and first carrier and forming an air passage from said first
fan to said metal block and thence to said radiator, said enclosure including a generally planar cover plate and a flow director
that consists of a generally curved, elongated rectangular strip and is positioned beneath said cover plate;
whereby thermal energy generated by the electronic components is transferred to said metal block and thence to said radiator
via said coolant and is ultimately removed from said radiator by an air flow drawn into said air passage.
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