| US 7,338,823 B2 | ||
| Side-emitting LED package and manufacturing method of the same | ||
| Kyung Taeg Han, Kyungki-do (Korea, Republic of); Hun Joo Hahm, Kyungki-do (Korea, Republic of); Dae Yeon Kim, Kyungki-do (Korea, Republic of); Ho Sik Ahn, Kyungki-do (Korea, Republic of); Seong Yeon Han, Kyungki-do (Korea, Republic of); Young Sam Park, Seoul (Korea, Republic of); and Seon Goo Lee, Kyungki-do (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyungki-Do (Korea, Republic of) | ||
| Filed on Jun. 01, 2006, as Appl. No. 11/444,397. | ||
| Claims priority of application No. 10-2005-0046796 (KR), filed on Jun. 01, 2005. | ||
| Prior Publication US 2006/0284203 A1, Dec. 21, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01); H01L 21/48 (2006.01) | ||
| U.S. Cl. 438—29 [438/26; 438/113; 438/116; 257/E33.072; 257/E33.059] | 8 Claims |
| 1. A manufacturing method of an LED package for emitting light from a light source sideward, the method comprising steps of:
(i) providing a substrate with electrodes formed thereon;
(ii) disposing light sources on the substrate;
(iii) forming a molded part on the substrate and the light sources disposed on the substrate;
(iv) dicing the molded part to divide into individual packaging parts;
(v) forming a reflective layer covering an outer surface of the molded part; and
(vi) dicing one side of the molded part and the reflective layer to form a light transmitting surface in one side.
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