| US 7,338,753 B2 | ||
| Method for manufacturing metal microstructure | ||
| Jun Yorita, Hyogo (Japan); Yoshihiro Hirata, Hyogo (Japan); and Tsuyoshi Haga, Hyogo (Japan) | ||
| Assigned to Sumitomo Electric Industries, Ltd., Osaka (Japan) | ||
| Filed on Aug. 14, 2006, as Appl. No. 11/503,303. | ||
| Application 11/503303 is a division of application No. 10/492918, granted, now 7,105,281, previously published as PCT/JP02/11120, filed on Oct. 25, 2002. | ||
| Claims priority of application No. 2001-330652 (JP), filed on Oct. 29, 2001; and application No. 2002-295077 (JP), filed on Oct. 08, 2002. | ||
| Prior Publication US 2006/0276044 A1, Dec. 07, 2006 | ||
| Int. Cl. G03F 7/039 (2006.01) | ||
| U.S. Cl. 430—320 [430/324; 205/67; 205/70] | 8 Claims |
| 1. A method of manufacturing a metal microstructure comprising the steps of:
forming a resin mold having a concave portion;
attaching on a conductive substrate a concave surface of said resin mold having a concave portion by interposing a photosensitive
polymer having a chemical composition changed by one of the group consisting of an electron beam, ultraviolet radiation and
visible radiation so as to form a layered structure having said resin mold;
polishing said resin mold having a concave portion so as to form a resin mold having a vacant portion penetrating in direction
of thickness;
exposing said layered structure having said resin mold to said one of the group consisting of said electron beam, said ultraviolet
radiation and said visible radiation;
removing an exposed photosensitive polymer existing at the vacant portion of said resin mold; and
filling with a metal the vacant portion of said layered structure having said resin mold by electroforming.
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