| US 7,499,614 B2 | ||
| Passive alignment of VCSELs to waveguides in opto-electronic cards and printed circuit boards | ||
| Eric A. Johnson, Greene, N.Y. (US); and David V. Caletka, Apalachin, N.Y. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Oct. 24, 2003, as Appl. No. 10/692,921. | ||
| Prior Publication US 2005/0089264 A1, Apr. 28, 2005 | ||
| Int. Cl. G02B 6/26 (2006.01) | ||
| U.S. Cl. 385—52 [385/14; 385/15; 385/129; 385/130; 385/132; 385/131; 385/143; 385/145] | 14 Claims |
| 1. An opto-electronic package facilitating the passive alignment of VCSELs to waveguides; said package comprising:
a substrate bearing a first surface;
a first cladding layer positioned on said first surface of said substrate;
a contact pad positioned on at least a position of the surface of said first cladding layer;
a second cladding layer located on a further surface position of said first cladding layer;
a waveguide channel being positioned in said second cladding layer, said first and second cladding layers each being constituted
of an organic material;
optical means being in optical communication with said waveguide channel in said second cladding layer and in electrical connection
with said contact pad on said first cladding layer, at least one transmitter/receiver chip being coupled to said surface of
said second cladding layer; and
at least one transmitter/receiver chip being coupled to said surface of said second cladding layer through the interposition
of C4-joints.
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