| US 7,498,900 B2 | ||
| System on chip structure comprising air cavity for isolating elements, duplexer, and duplexer fabrication method thereof | ||
| Joo-ho Lee, Seoul (Korea, Republic of); Hae-seok Park, Yongin-si (Korea, Republic of); In-sang Song, Seoul (Korea, Republic of); Byeoung-ju Ha, Seongnam-si (Korea, Republic of); and Seog-woo Hong, Yongin-si (Korea, Republic of) | ||
| Assigned to Samsung Electronics Co., Ltd., Suwon-si (Korea, Republic of) | ||
| Filed on Sep. 08, 2006, as Appl. No. 11/517,371. | ||
| Claims priority of application No. 10-2005-0119113 (KR), filed on Dec. 07, 2005. | ||
| Prior Publication US 2007/0126527 A1, Jun. 07, 2007 | ||
| Int. Cl. H03H 9/00 (2006.01) | ||
| U.S. Cl. 333—133 [333/187] | 15 Claims |
| 1. A duplexer comprising:
a substrate;
a transmitter filter fabricated in a predetermined first area of the substrate;
a receiver filter fabricated in a predetermined second area of the substrate; and
an air cavity fabricated in an area between the predetermined first and second areas to isolate the transmitter and receiver
filters from each other,
wherein each of the transmitter and receiver filters comprises one or more air gap type serial resonators and one or more
air gap type parallel resonators.
|