| US 7,498,722 B2 | ||
| Piezoelectric device | ||
| Masayuki Sakai, Kouza-gun (Japan) | ||
| Assigned to Epson Toyocom Corporation, Tokyo (Japan) | ||
| Filed on Apr. 16, 2007, as Appl. No. 11/785,218. | ||
| Claims priority of application No. 2006-123022 (JP), filed on Apr. 27, 2006. | ||
| Prior Publication US 2007/0252482 A1, Nov. 01, 2007 | ||
| Int. Cl. H01L 41/053 (2006.01) | ||
| U.S. Cl. 310—340 | 3 Claims |
| 1. A piezoelectric device, comprising:
a piezoelectric element package having a piezoelectric element accommodated therein and a connection terminal formed on a
side surface and a bottom surface thereof;
a circuit element coupled to the connection terminal on the bottom surface of the piezoelectric element package;
an insulating resin portion being in an essentially rectangular parallelepiped shape and covering the circuit element;
an external electrode formed on a bottom surface of the resin portion; and
a connection electrode formed on the side surface of the piezoelectric element package and a side surface of the resin portion
and coupling the connection terminal formed on the side surface of the piezoelectric element package and the external electrode
on the resin portion.
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