| US 7,498,646 B2 | ||
| Structure of image sensor module and a method for manufacturing of wafer level package | ||
| Wen Kun Yang, Hsinchu (Taiwan); and Wen Pin Yang, Hsinchu (Taiwan) | ||
| Assigned to Advanced Chip Engineering Technology Inc., Hsinchu County (Taiwan) | ||
| Filed on Jul. 19, 2006, as Appl. No. 11/488,653. | ||
| Prior Publication US 2008/0017941 A1, Jan. 24, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 31/00 (2006.01) | ||
| U.S. Cl. 257—432 [257/E31.11] | 19 Claims |
| 1. A image sensor module, comprising:
a metal alloy base, wherein material of said metal alloy base comprises Fe—Ni alloy, Fe—Ni—Co alloy, Cu—Fe alloy, Cu—Cr alloy,
Cu—Ni—Si alloy, Cu—Sn alloy or Fe—Ni alloy laminated fiber glass materials;
an image sensor die having a plurality of solder balls coupled to said metal alloy base;
a protection film formed on a micro lens area of said image sensor die;
a lens holder having a plurality of lens configured on said image sensor die; and
flexible printed circuits (F.P.C.) having a plurality of conductive solder joints coupled to said solder balls for transmitting
signal of said image sensor die, wherein said lens holder is placed in said flexible printed circuits.
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