| US 7,498,606 B2 | ||
| Microelectronic imaging units and methods of manufacturing microelectronic imaging units | ||
| Bret K. Street, Meridian, Id. (US); Frank L. Hall, Boise, Id. (US); and James M. Derderian, Boise, Id. (US) | ||
| Assigned to Micron Technology, Inc., Boise, Id. (US) | ||
| Filed on Jun. 01, 2006, as Appl. No. 11/444,404. | ||
| Application 11/444404 is a division of application No. 10/915180, filed on Aug. 10, 2004, granted, now 7,364,934. | ||
| Prior Publication US 2006/0216850 A1, Sep. 28, 2006 | ||
| Int. Cl. H01L 27/15 (2006.01); H01L 31/12 (2006.01); H01L 33/00 (2006.01) | ||
| U.S. Cl. 257—79 [257/433; 257/434; 438/61; 438/66] | 25 Claims |
| 1. A plurality of microelectronic imaging units, comprising:
a support member;
a plurality of imaging dies attached to the support member, the individual imaging dies comprising a first height, an image
sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled
to the integrated circuit;
a base on the support member between adjacent imaging dies, the base having a second height Less than or approximately equal
to the first height of the dies; and
a plurality of covers attached to the base and positioned over corresponding image sensors.
|