| US 7,498,604 B2 | ||
| Deposition stop time detection apparatus and methods for fabricating copper using the same | ||
| Jae-Won Han, Bucheon (Korea, Republic of) | ||
| Assigned to Dongbu HiTek Co., Ltd., Seoul (Korea, Republic of) | ||
| Filed on Sep. 12, 2006, as Appl. No. 11/520,303. | ||
| Application 11/520303 is a continuation of application No. 10/869263, filed on Jun. 16, 2004, granted, now 7,122,387. | ||
| Claims priority of application No. 10-2003-0039907 (KR), filed on Jun. 19, 2003. | ||
| Prior Publication US 2007/0010034 A1, Jan. 11, 2007 | ||
| Int. Cl. H01L 23/58 (2006.01); H01L 29/10 (2006.01) | ||
| U.S. Cl. 257—48 [438/17; 257/E21.522; 257/E21.531] | 20 Claims |
| 1. A deposition stop time detection apparatus comprising:
a plurality of detection electrodes;
a guide device positioned on a semiconductor substrate for positioning the detection electrodes at a predetermined distance
vertically and horizontally inside a plurality of corresponding trenches in the semiconductor substrate; and
a circuit electrically connected to the plurality of detection electrodes and configured to generate an electric signal when
at least two of the plurality of detection electrodes are electrically connected by a metal layer deposited in the trenches.
|