US 7,498,556 B2
Image sensor module having build-in package cavity and the method of the same
Wen-Kun Yang, Hsin-Chu (Taiwan); Diann-Fang Lin, Hukou Township, Hsinchu County (Taiwan); Jui-Hsien Chang, Jhudong Township, Hsinchu County (Taiwan); and Tung-Chuan Wang, Yangmei Town (Taiwan)
Assigned to Adavanced Chip Engineering Technology Inc., (Taiwan)
Filed on Mar. 15, 2007, as Appl. No. 11/725,041.
Prior Publication US 2008/0224248 A1, Sep. 18, 2008
Int. Cl. H01L 27/00 (2006.01)
U.S. Cl. 250—208.1  [250/239; 257/698] 15 Claims
OG exemplary drawing
 
1. An image sensor module structure, comprising:
a substrate with a package-receiving cavity formed in an upper surface of said substrate and conductive traces formed within said substrate, wherein said substrate includes a contact metal formed thereon;
a package having an opening to expose a micro-lens area and a fan-out build up layer with terminal metal pads formed on a side edge of said package, said package being disposed within said package-receiving cavity;
a solder bridge formed on said terminal metal pads of said package and said substrate to communicate with said conductive trace through said contact metal;
a lens holder attached on said substrate, said lens holder having a lens attached to an upper portion of said lens holder; and wherein said package includes:
a base;
a die having said micro-lens area attached to said base;
a first material surrounding said die, wherein said surface of said first material is formed level with said die surface;
a dielectric layer formed on said die and said the first material, wherein said dielectric layer has an opening to expose said micro-lens and I/O pads;
a redistribution conductive layer (RDL) formed on said dielectric layer, wherein said RDL is coupled to said die and said terminal contact pads; and
a protective dielectric layer formed over said RDL, and having an opening to expose said micro-lens and terminal contact pads.