| US 7,498,250 B2 | ||
| Shapes-based migration of aluminum designs to copper damascene | ||
| Timothy G. Dunham, South Burlington, Vt. (US); Ezra D. B. Hall, Richmond, Vt. (US); Howard S. Landis, Underhill, Vt. (US); Mark A. Lavin, Katonah, N.Y. (US); and William C. Leipold, Enosburg Falls, Vt. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on Aug. 13, 2007, as Appl. No. 11/837,768. | ||
| Application 11/837768 is a division of application No. 11/256025, filed on Oct. 21, 2005, granted, now 7,312,141. | ||
| Application 10/305644 is a division of application No. 09/670411, filed on Sep. 26, 2000, granted, now 6,528,883. | ||
| Application 11/256025 is a continuation in part of application No. 10/305644, filed on Nov. 26, 2002, granted, now 6,992,002. | ||
| Prior Publication US 2007/0275551 A1, Nov. 29, 2007 | ||
| Int. Cl. H01L 21/44 (2006.01) | ||
| U.S. Cl. 438—597 [257/E21.575] | 13 Claims |
| 1. A method of manufacturing an integrated circuit, comprising:
providing a dielectric layer having a bottom surface disposed over a semiconductor substrate;
simultaneously forming a first trench and a multiplicity of second trenches in said dielectric layer, said first trench including
dielectric pedestals within said first trench, said dielectric pedestals comprised of said dielectric layer; and
simultaneously completely filling said first trench and said multiplicity of second trenches with a layer of metal to form
respectively a wire having dielectric pedestals therein and a set of metal fill shapes, said metal fill shapes extending from
a top surface of said dielectric layer toward said bottom surface of said dielectric layer, said metal fill shapes arranged
in a first pattern,
said dielectric pedestals extending from a top surface of said wire to a bottom surface of said wire, sides of said dielectric
pedestals completely surrounded by said wire, said dielectric pedestals arranged in a second pattern, wherein said second
pattern is an offset-grid, said offset grid having a pitch defined by a width of said wire.
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