| US 7,498,203 B2 | ||
| Thermally enhanced BGA package with ground ring | ||
| Chris Haga, McKinney, Tex. (US); and Leland Swanson, McKinney, Tex. (US) | ||
| Assigned to Texas Instruments Incorporated, Dallas, Tex. (US) | ||
| Filed on Apr. 20, 2006, as Appl. No. 11/407,836. | ||
| Prior Publication US 2007/0246823 A1, Oct. 25, 2007 | ||
| Int. Cl. H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01) | ||
| U.S. Cl. 438—122 [438/125] | 9 Claims |
| 1. A method of fabricating a BGA package comprising the steps of:
providing a package substrate having a chip site for receiving a chip and a conductive ground ring surrounding an insulative
gap encircling the chip site;
operably connecting a frontside of a chip having a frontside and a backside to the substrate chip site;
underfilling between the substrate chip site and the chip with dielectric material;
providing a heat spreader having at least a conductive ground ring portion configured to coincide with the substrate conductive
ground ring and configured for operably electrically coupling to the backside of the chip with an electrically conductive
adhesive material;
affixing the heat spreader to the backside of the chip; and
interposing conductive material between the heat spreader conductive ground ring and the substrate conductive ground ring,
thereby forming an electrically continuous annulus of conductive material from the substrate conductive ground ring to the
heat spreader conductive ground ring.
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