| US 7,498,202 B2 | ||
| Method for die attaching | ||
| Hung-Ta Hsu, Daliao Township, Kaohsiung County (Taiwan); Tzu-Bin Lin, Kaohsiung (Taiwan); Ya-Ling Huang, Kaohsiung (Taiwan); and Ya-Yu Hsieh, Lujhu Township, Kaohsiung County (Taiwan) | ||
| Assigned to Advanced Semiconductor Engineering, Inc., Kaohsiung (Taiwan) | ||
| Filed on Dec. 05, 2005, as Appl. No. 11/293,992. | ||
| Claims priority of application No. 93137655 A (TW), filed on Dec. 06, 2004. | ||
| Prior Publication US 2006/0121644 A1, Jun. 08, 2006 | ||
| Int. Cl. H01L 21/00 (2006.01) | ||
| U.S. Cl. 438—118 [438/106; 438/113; 438/464; 257/E21.449; 257/E21.514] | 15 Claims |
| 1. A method for die attaching, comprising:
providing at least a die;
providing at least a die-attach preform, wherein the step of providing the die-attach preform further comprises:
forming a die attaching material on a plate by using a stencil printing method;
partly solidifying the die attaching material to form the plurality of die-attach preforms; and
sawing the partly solidified die attaching material to form the die-attach preform with appropriate size;
picking and placing the die-attach preform on a die carrier;
picking and placing the die on the die-attach preform; and
heating the die-attach preform to adhere the die and the die carrier at the same time.
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