| US 7,498,120 B2 | ||
| Vacuum compatible high frequency electromagnetic and millimeter wave source components, devices and methods of micro-fabricating | ||
| Laurence P. Sadwick, Salt Lake City, Utah (US); Jehn-Huar Chern, Salt Lake City, Utah (US); and Ruey-Jen Hwu, Salt Lake City, Utah (US) | ||
| Assigned to Innosys, Inc., Salt Lake City, Utah (US) | ||
| Filed on Sep. 15, 2004, as Appl. No. 10/941,689. | ||
| Prior Publication US 2006/0057505 A1, Mar. 16, 2006 | ||
| Int. Cl. G03F 7/00 (2006.01) | ||
| U.S. Cl. 430—315 [430/319; 430/321] | 50 Claims |
| 1. A method of micro-fabricating high frequency electromagnetic wave source components, comprising:
providing a substrate;
providing a UV-curable photoresist;
using said UV-curable photoresist and photolithography to define at least one from the group consisting of: an output cavity,
a waveguide and an alignment feature, on said substrate, wherein using a UV-curable photoresist and photolithography to define
at least one of an output cavity, a waveguide or an alignment feature comprises:
coating said substrate with a UV-curable photoresist;
heating said UV-curable photoresist coated substrate at a predetermined temperature and for a predetermined heating duration
to drive off solvent in said UV-curable photoresist to obtain a solid UV-curable photoresist layer having a predetermined
thickness;
masking said UV-curable photoresist coated substrate with a mask defining said at least one of an output cavity, a waveguide
or an alignment feature;
exposing said masked UV-curable photoresist coated substrate to UV light comprising a predetermined intensity for a predetermined
exposure time to obtain cured and uncured photoresist;
removing said uncured photoresist leaving said at least one of an output cavity, a waveguide or an alignment feature having
substantially vertical sidewalls; and
plating said at least one of an output cavity, a waveguide or an alignment feature; and
using said UV-curable photoresist and photolithography to define at least one from the group consisting of: a coupling slot,
a waveguide iris and a pumpout feature, on said substrate.
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