| US 7,498,062 B2 | ||
| Method and apparatus for applying a voltage to a substrate during plating | ||
| Anthony Calcaterra, Milpitas, Calif. (US); and David Knox, La Mirada, Calif. (US) | ||
| Assigned to WD Media, Inc., San Jose, Calif. (US) | ||
| Filed on May 26, 2004, as Appl. No. 10/853,953. | ||
| Prior Publication US 2005/0274605 A1, Dec. 15, 2005 | ||
| Int. Cl. B05D 1/18 (2006.01); C25D 5/00 (2006.01); C25D 7/00 (2006.01) | ||
| U.S. Cl. 427—430.1 [427/437; 427/443.1; 205/137; 205/143; 205/145] | 8 Claims |
| 1. A method for plating one or more substrates comprising:
holding an outer edge of one or more substrates within a plating bath with a plurality of elongated arms, at least one of
said arms being coupled to a source of electrical power and communicating said electrical power to said one or more substrates,
said plurality of elongated arms being coupled to a connecting member;
rotating said connecting member, whereby said elongated arms and said substrates rotate about the axis of rotation of said
connecting member; and
plating said one or more substrates.
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