| US 7,497,938 B2 | ||
| Tribo-chronoamperometry as a tool for CMP application | ||
| Jian Zhang, Aurora, Ill. (US); Steven K. Grumbine, Aurora, Ill. (US); and Phillip W. Carter, Naperville, Ill. (US) | ||
| Assigned to Cabot Microelectronics Corporation, Aurora, Ill. (US) | ||
| Filed on Mar. 22, 2005, as Appl. No. 11/88,075. | ||
| Prior Publication US 2006/0213781 A1, Sep. 28, 2006 | ||
| Int. Cl. B23H 3/02 (2006.01) | ||
| U.S. Cl. 205—644 [205/641; 205/645; 205/206; 205/222] | 36 Claims |
| 1. A method of determining at least one electrochemical characteristic of a chemical-mechanical polishing system comprising
(a) a reactive substrate and (b) an aqueous solution, the method comprising:
(i) providing an electrochemical cell comprising:
(a) a reactive substrate comprising at least one conductive material,
(b) an aqueous solution with a conductivity of about 10 μS or more, and
(c) an electrode,
wherein the reactive substrate and the electrode are in fluid communication with the aqueous solution, and wherein a first
potential exists between the reactive substrate and the electrode,
(ii) changing the first potential to a second potential, wherein the second potential is different than the first potential,
such that a current is generated between the reactive substrate and the electrode,
(iii) collecting data wherein the data comprise an electrochemical cell current,
(iv) determining the at least one electrochemical characteristic of the chemical-mechanical polishing system by analysis of
the data, and
(v) determining at least one polishing characteristic of the chemical-mechanical polishing system using the at least one electrochemical
characteristic of the chemical-mechanical polishing system,
wherein the at least one electrochemical characteristic of the chemical-mechanical polishing system is selected from the group
consisting of stable current, total magnitude of current reduction, maximum current, and time constant of current reduction.
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