| US 7,497,763 B2 | ||
| Polishing pad, a polishing apparatus, and a process for using the polishing pad | ||
| Brian E. Bottema, Austin, Tex. (US); Stephen F. Abraham, Austin, Tex. (US); and Alex P. Pamatat, Grenoble (France) | ||
| Assigned to Freescale Semiconductor, Inc., Austin, Tex. (US) | ||
| Filed on Mar. 27, 2006, as Appl. No. 11/390,176. | ||
| Prior Publication US 2007/0224917 A1, Sep. 27, 2007 | ||
| Int. Cl. B24B 49/00 (2006.01) | ||
| U.S. Cl. 451—6 [451/10; 451/11; 451/41] | 20 Claims |
| 1. A process of polishing comprising:
providing a polishing pad comprising:
a first layer comprising:
a first polishing surface; and
a first opening extending through the first layer;
a second layer distinct from and adjacent to the first layer, wherein the second layer comprises:
a pad attaching surface; and
a second opening extending through the second layer, the second opening substantially contiguous with the first opening of
the first layer;
wherein a first perimeter of the first opening has a different cross-section size than a second perimeter of the second opening;
and
a pad window lying within the first opening, the pad window comprising:
a second polishing surface substantially contiguous with the first polishing surface of the first layer, and lying in substantially
a same plane as the first polishing surface; and
an opposing surface opposite the second polishing surface, and designed to abut an exterior surface of a platen window; attaching
the pad to a platen so that the pad window and platen window abut;
applying a fluid to the first polishing surface, wherein the polishing pad is attached to a platen;
placing a workpiece adjacent to the polishing pad;
compressing the polishing pad between the workpiece and the platen; and
polishing the workpiece such that the pad window contacts the workpiece.
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