| US 7,497,111 B2 | ||
| Surface shape measuring apparatus, surface measuring method, and exposure apparatus | ||
| Hideki Ina, Yokohama (Japan) | ||
| Assigned to Canon Kabushiki Kaisha, Tokyo (Japan) | ||
| Filed on Oct. 12, 2005, as Appl. No. 11/249,295. | ||
| Claims priority of application No. 2004-297158 (JP), filed on Oct. 12, 2004. | ||
| Prior Publication US 2006/0076488 A1, Apr. 13, 2006 | ||
| Int. Cl. G01B 5/28 (2006.01) | ||
| U.S. Cl. 73—105 | 3 Claims |
| 1. An apparatus for measuring a shape of a surface of an object, the apparatus comprising:
a structure to be faced to the surface of the object, the structure being made from a silicon-on-insulator including a first
layer made of silicon, a second layer made of oxide silicon and located on the first layer and a third layer made of silicon
and located on the second layer, an array of spaced flat silicon regions being formed from the first layer and serving as
an array of probes, an array of spaced concave parts being formed in the third layer and respectively arranged above the array
of spaced flat silicon regions, the structure being configured so that the third layer surrounds each of the array of spaced
flat silicon regions and supports each of the array of spaced flat silicon regions via the second layer and each of the array
of spaced flat silicon regions is movable relative to the third layer;
an optical system configured to project a measurement light onto the second layer on one of the array of spaced flat silicon
regions through corresponding one of the array of spaced concave parts and to receive the measurement light reflected off
the second layer with respect to each of the array of spaced flat silicon regions; and
a detector configured to detect the reflected measurement light from the optical system with respect to each of the array
of spaced flat silicon regions.
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