| US 7,497,026 B2 | ||
| Method and system for detection of wafer centering in a track lithography tool | ||
| Harald Herchen, Los Altos, Calif. (US); Lily Pang, Fremont, Calif. (US); and Erica Porras, Los Gatos, Calif. (US) | ||
| Assigned to Sokudo Co., Ltd., Kyoto (Japan) | ||
| Filed on Jun. 14, 2007, as Appl. No. 11/763,352. | ||
| Claims priority of provisional application 60/884587, filed on Jan. 11, 2007. | ||
| Prior Publication US 2008/0168673 A1, Jul. 17, 2008 | ||
| Int. Cl. H01L 21/00 (2006.01); G01B 9/00 (2006.01) | ||
| U.S. Cl. 33—550 [33/520; 250/492.2; 438/16] | 18 Claims |
| 1. A system for measuring substrate concentricity, the system comprising:
a substrate support member adapted to rotate a substrate around a substantially vertical axis, the substrate comprising a
mounting surface and a process surface;
a spin cup positioned below the substrate;
a translatable arm mounted a predetermined distance above the process surface of the substrate, wherein the translatable arm
is adapted to translate along a radius of the substrate;
an optical emitter mounted on the translatable arm; and
an optical detector mounted on the translatable arm.
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