US 7,496,878 B2
Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package
Tamotsu Kitamura, Nagano (Japan); and Norihide Hanami, Nagano (Japan)
Assigned to Shinko Electrics Industries Co., Ltd., Nagano (Japan)
Filed on Apr. 12, 2005, as Appl. No. 11/103,626.
Claims priority of application No. 2004-118242 (JP), filed on Apr. 13, 2004.
Prior Publication US 2005/0229138 A1, Oct. 13, 2005
Int. Cl. G06F 17/50 (2006.01)
U.S. Cl. 716—13  [716/12; 716/14; 716/15] 44 Claims
OG exemplary drawing
 
1. A semiconductor package automatic wiring apparatus which determines an optimum wiring route from each pad to a corresponding one of vias on a semiconductor package having a multi-tier bonding pad structure in which pads to be connected to a semiconductor chip are arranged in multiple rows, said apparatus comprising:
a row identifier identifying a row for said each pad as to which row said pad belongs to;
a tentative placer mapping a position of said each pad to a position on a matrix table after said each pad has been identified by said row identifier as to which row said pad belongs to; and
a determiner reading out said matrix table and determining said optimum wiring route based on said read matrix table, wherein a pad-to-pad space through which said wiring route can pass corresponds to a blank entry between adjacent columns in said matrix table,
wherein said tentative placer includes
a drawer drawing an extension line on a virtual plane from said each pad identified by said row identifying as to which row said pad belongs to, said extension line extending in a direction in which a wiring line is run from said semiconductor chip to said pad or in a direction in which said pad is oriented, and
an evaluator evaluating a positional relationship between the extension line drawn from said pad belonging to a first row and a pad belonging to a second row adjacent to said first row, and
wherein said matrix table is generated based on said positional relationship evaluated by said evaluator.