| US 7,495,913 B1 | ||
| Heat dissipating assembly having a fan duct | ||
| Peng Liu, Shenzhen (China); Jun Cao, Shenzhen (China); and Shi-Wen Zhou, Shenzhen (China) | ||
| Assigned to Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Foxconn Technology Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan) | ||
| Filed on Aug. 09, 2007, as Appl. No. 11/836,718. | ||
| Int. Cl. H05K 7/20 (2006.01); F28F 7/00 (2006.01) | ||
| U.S. Cl. 361—697 [165/80.3; 165/121; 361/695] | 16 Claims |
| 1. A heat dissipating assembly adapted for dissipating heat generated by a plurality of electronic components, the heat dissipating
assembly comprising:
a heat sink adapted for absorbing the heat from one of the electronic components;
a fan being mounted on a front side of the heat sink; and
a fan duct being secured to the fan for sandwiching the fan between the fan duct and the heat sink, the fan duct defining
an outlet adjacent to the fan and an inlet, the outlet being oriented towards the fan and the inlet being oriented toward
another one of the electronic components in a manner such that an airflow produced by the fan flows first through the another
one of the electronic components thereby cooling the another one of the electronic components, then into the fan duct through
the inlet thereof, and finally through the outlet to flow into and cool the heat sink.
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