| US 7,495,334 B2 | ||
| Stacking system and method | ||
| Russell Rapport, Austin, Tex. (US); James W. Cady, Austin, Tex. (US); James Wilder, Austin, Tex. (US); David L. Roper, Austin, Tex. (US); James Douglas Wehrly, Jr., Austin, Tex. (US); Jeff Buchle, Austin, Tex. (US); and Julian Dowden, Austin, Tex. (US) | ||
| Assigned to Entorian Technologies, LP, Austin, Tex. (US) | ||
| Filed on Aug. 04, 2005, as Appl. No. 11/197,267. | ||
| Application 11/197267 is a continuation of application No. 10/814530, filed on Mar. 13, 2004, abandoned. | ||
| Application 10/814530 is a continuation of application No. 10/453398, filed on Jun. 03, 2003, granted, now 6,914,324. | ||
| Application 10/453398 is a continuation in part of application No. 10/005581, filed on Oct. 26, 2001, granted, now 6,576,992. | ||
| Application 10/453398 is a continuation in part of application No. 11/197267, filed on Aug. 04, 2005. | ||
| Application 11/197267 is a continuation in part of application No. 10/400309, filed on Mar. 27, 2003, abandoned. | ||
| Application 10/400309 is a continuation of application No. 10/005581, filed on Oct. 26, 2001, granted, now 6,576,992. | ||
| Prior Publication US 2005/0280135 A1, Dec. 22, 2005 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01) | ||
| U.S. Cl. 257—738 [257/686; 257/737; 361/735; 361/736] | 30 Claims |
| 1. A high-density circuit module comprising:
a first CSP having a body with first and second lateral sides and upper and lower major surfaces with contacts along the lower
major surface;
a second CSP having a body with first and second lateral sides and upper and lower major surfaces with contacts along the
lower major surface;
a form standard disposed along the-upper major surface of the body of the first CSP and having first and second curvature
areas arcing around the first and second lateral sides of the body of the first CSP, respectively;
a first flex circuit having first and second conductive layers between which conductive layers is an intermediate layer;
a second flex circuit having first and second conductive layers between which conductive layers is an intermediate layer;
the first and second flex circuits being disposed, in part, beneath the body of the second CSP and above the form standard
as it is disposed along the upper surface of the body of the first CSP and about the first and second curvature areas of the
form standard, respectively, and beneath the lower major surface of the body of the first CSP to connect with the contacts
along the lower major surface of the first CSP; and
a set of module contacts connected to the first and second flex circuits.
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