| US 7,495,323 B2 | ||
| Semiconductor package structure having multiple heat dissipation paths and method of manufacture | ||
| Stephen St. Germain, Scottsdale, Ariz. (US); Phillip Celaya, Gilbert, Ariz. (US); Roger Arbuthnot, Mesa, Ariz. (US); and Francis J. Carney, Queen Creek, Ariz. (US) | ||
| Assigned to Semiconductor Components Industries, L.L.C., Phoenix, Ariz. (US) | ||
| Filed on Aug. 30, 2006, as Appl. No. 11/468,542. | ||
| Prior Publication US 2008/0054438 A1, Mar. 06, 2008 | ||
| Int. Cl. H01L 23/495 (2006.01); H01L 21/00 (2006.01); H05K 7/20 (2006.01) | ||
| U.S. Cl. 257—676 [257/707; 257/713; 257/787; 257/797; 257/E23.052; 257/E23.179; 438/122; 438/123; 438/127; 438/462; 361/707; 361/709] | 18 Claims |
| 1. A semiconductor package structure having multiple heat dissipation paths comprising:
a semiconductor component having first and second opposing surfaces;
a conductive support structure having a plurality of support pads, wherein the first surface of the semiconductor component
is coupled to one or more of the plurality of support pads and wherein at least two of the support pads have an alignment
structure formed therein;
a conductive connective bridge coupled to the second surface of the semiconductor component, wherein the conductive connective
bridge comprises coupling portions on opposing ends, and wherein the coupling portions are aligned to the alignment structure
on at least two support pads, and wherein the coupling portions extend from a major surface of the conductive connective bridge,
and wherein the coupling portions are in physical contact with the alignment structures without an intervening material, and
wherein the coupling portions and the alignment structures are configured to enhance planarity between the conductive connective
bridge and semiconductor component; and
an encapsulating layer passivating portions of the semiconductor package structure while leaving portions of the conductive
connective bridge and portions of the plurality of supports pads exposed to provide the multiple heat dissipation paths.
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