| US 7,495,179 B2 | ||
| Components with posts and pads | ||
| Yoichi Kubota, Pleasanton, Calif. (US); Teck-Gyu Kang, San Jose, Calif. (US); Jae M. Park, San Jose, Calif. (US); and Belgacem Haba, Saratoga, Calif. (US) | ||
| Assigned to Tessera, Inc., San Jose, Calif. (US) | ||
| Filed on Jun. 24, 2005, as Appl. No. 11/166,982. | ||
| Application 11/166982 is a continuation in part of application No. 10/959465, filed on Oct. 06, 2004. | ||
| Claims priority of provisional application 60/533210, filed on Dec. 30, 2003. | ||
| Claims priority of provisional application 60/533393, filed on Dec. 30, 2003. | ||
| Claims priority of provisional application 60/533437, filed on Dec. 30, 2003. | ||
| Claims priority of provisional application 60/508970, filed on Oct. 06, 2003. | ||
| Claims priority of provisional application 60/583109, filed on Jun. 25, 2004. | ||
| Prior Publication US 2005/0284658 A1, Dec. 29, 2005 | ||
| Int. Cl. H05K 1/16 (2006.01) | ||
| U.S. Cl. 174—260 [361/760; 361/783] | 14 Claims |
| 1. A connection component for mounting a microelectronic element, said connection component comprising:
(a) a dielectric layer having an upwardly-facing inner surface and a downwardly-facing outer surface;
(b) electrically conductive traces extending on said dielectric layer remote from said outer surface;
(c) electrically conductive posts extending from said traces through said dielectric layer and projecting downwardly beyond
said outer surface of said dielectric layer; and
(d) electrically conductive pads exposed at said outer surface of said dielectric layer, at least some of said pads being
electrically connected to at least some of said posts by at least some of said traces wherein said pads define exposed pad
surfaces recessed upwardly from said outer surface.
|