	US 7,494,838 B2
	Manufacturing method for magnetic sensor and lead frame therefor
Hiroshi Adachi, Hamamatsu (Japan); Hiroshi Saitoh, Iwata-gun (Japan); Kenichi Shirasaka, Hamamatsu (Japan); Hideki Sato, Hamamatsu (Japan); and Masayoshi Omura, Hamamatsu (Japan)
Assigned to Yamaha Corporation, (Japan)
Filed on Nov. 07, 2006, as Appl. No. 11/593,588.
Application 11/593588 is a division of application No. 10/627717, filed on Jul. 28, 2003, granted, now 7,187,063.
Claims priority of application No. 2002-220411 (JP), filed on Jul. 29, 2002; application No. 2002-220412 (JP), filed on Jul. 29, 2002; application No. 2002-220413 (JP), filed on Jul. 29, 2002; application No. 2002-220414 (JP), filed on Jul. 29, 2002; application No. 2002-220415 (JP), filed on Jul. 29, 2002; application No. 2003-202103 (JP), filed on Jul. 25, 2003; application No. 2003-202104 (JP), filed on Jul. 25, 2003; application No. 2003-202105 (JP), filed on Jul. 25, 2003; application No. 2003-202106 (JP), filed on Jul. 25, 2003; and application No. 2003-202107 (JP), filed on Jul. 25, 2003.
Prior Publication US 2007/0099349 A1, May 03, 2007
Int. Cl. H01L 23/00 (2006.01)

U.S. Cl. 438—48 [438/57; 438/123]

15 Claims

1. A manufacturing method of a magnetic sensor encapsulating at least one magnetic sensor chip having sensitivity to magnetism in at least one direction in a molded resin, comprising the steps of:

providing a lead frame made of a thin metal plate, which comprises at least two stages, a frame having a plurality of leads arranged so as to encompass the stages, and a plurality of interconnecting members for interconnecting together the frame and the stages;

inclining the stages relative to the frame upon plastic deformation of the interconnecting members;

pressing the stages under pressure while fixing the frame in a prescribed position, thus elastically deforming the interconnecting members;

bonding the magnetic sensor chip onto the stage while the stage and the frame are both placed substantially in a same plane;

arranging wires so as to interconnect together the leads and the magnetic sensor chip; and

releasing the stages from the pressure, thus restoring the interconnecting members from elastically deformed states thereof.