| US 7,494,286 B2 | ||
| Laser module and method for manufacturing the same | ||
| Akihiro Morikawa, Osaka (Japan); Toshifumi Yokoyama, Katono (Japan); Yasuo Kitaoka, Ibaraki (Japan); and Kazuhisa Yamamoto, Takatsuki (Japan) | ||
| Assigned to Panasonic Corporation, Osaka (Japan) | ||
| Appl. No. 10/534,438 PCT Filed Nov. 12, 2003, PCT No. PCT/JP03/14343 § 371(c)(1), (2), (4) Date May 10, 2005, PCT Pub. No. WO2004/049526, PCT Pub. Date Jun. 10, 2004. |
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| Claims priority of application No. 2002-328053 (JP), filed on Nov. 12, 2002. | ||
| Prior Publication US 2006/0034570 A1, Feb. 16, 2006 | ||
| Int. Cl. G02B 6/36 (2006.01); G02B 6/12 (2006.01) | ||
| U.S. Cl. 385—88 [385/14] | 12 Claims |
| 1. A laser module, comprising:
a sub-mount;
a semiconductor laser secured to a surface of the sub-mount; and
an optical waveguide device joined to the surface of the sub-mount by an adhesive layer so that the optical waveguide device
is coupled optically with the semiconductor laser,
wherein a first groove is formed at the surface of the sub-mount at a region corresponding to an incident end side of the
optical waveguide device, the first groove being formed parallel to an outgoing end face of the semiconductor laser with a
predetermined space therefrom, and
wherein a second groove is formed at the surface of the sub-mount at a region corresponding to the incident end side of the
optical waveguide device, the second groove being formed parallel to the first groove and being positioned between the first
groove and the outgoing end face of the optical waveguide device,
wherein a distance L1 between the first groove and the second groove satisfies 1 mm<L1<L/2, where L denotes a length of the optical waveguide device, and
the adhesive layer is formed as a single layer provided under the optical waveguide device ranging from a surface of the sub-mount
to the inside of the first groove, so that an end portion of the adhesive layer on the incident end side of the optical waveguide
device is positioned inside the first groove so as to adhere to a surface of a wall of the first groove under the optical
waveguide device and does not contact with the outgoing end face of the semiconductor laser.
|