| US 7,494,195 B2 | ||
| Electronic device enclosure | ||
| Shao-Bo Han, Shenzhen (China) | ||
| Assigned to Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Shenzhen, Guangdong Province (China); and Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien (Taiwan) | ||
| Filed on Nov. 22, 2005, as Appl. No. 11/284,651. | ||
| Claims priority of application No. 2004 2 0102008 U (CN), filed on Nov. 26, 2004. | ||
| Prior Publication US 2006/0113103 A1, Jun. 01, 2006 | ||
| Int. Cl. H02G 3/08 (2006.01) | ||
| U.S. Cl. 312—223.2 [312/328] | 10 Claims |
| 1. An electronic device enclosure, comprising:
a base;
a bracket pivotally connected to the base, the bracket being rotatable around a first fixed axis between a first position
at which the bracket is generally received in the base, and a second position at which the bracket is generally suspended
over the base; and
a pair of connecting pieces each having one end pivotably connected to the bracket around a second fixed axis spaced from
the first fixed axis, and an opposite end rotatably and slidably attached to the base;
wherein the base comprises a pair of side panels, and the bracket comprises a pair of sidewalls corresponding to the side
panels respectively,
the base further comprises a front panel connecting between the side panels, the front panel is lower than the side panels
in height, and the bracket further comprises a front wall capable of seating on the front panel of the base.
|