| US 7,493,690 B2 | ||
| Method of attaching electronic components to printed circuit board and attachment structure thereof | ||
| Shigeru Muto, Takanezawa-machi (Japan); Akira Sato, Kakuda (Japan); Kohya Shimano, Kakuda (Japan); Norio Tamate, Kakuda (Japan); Tomoyuki Honda, Kakuda (Japan); Takuji Yamamoto, Wako (Japan); Kazuhisa Yamamoto, Wako (Japan); Takatoshi Ota, Wako (Japan); and Hiroshi Ikeba, Wako (Japan) | ||
| Assigned to Keihin Corporation, Tokyo (Japan); and Honda Motor Co., Ltd., Tokyo (Japan) | ||
| Filed on Jul. 05, 2005, as Appl. No. 11/172,991. | ||
| Claims priority of application No. 2004-199118 (JP), filed on Jul. 06, 2004. | ||
| Prior Publication US 2006/0005996 A1, Jan. 12, 2006 | ||
| Int. Cl. H05K 3/34 (2006.01) | ||
| U.S. Cl. 29—840 [174/260] | 5 Claims |
| 1. A method of attaching an electronic component to a printed circuit board by a plurality of screws that are inserted into
corresponding through holes cut in the board from a surface of the board and then screwed into corresponding screw holes formed
in the component mounted on an opposite surface, comprising the steps of:
(a) screwing the component onto the board using one of the screws;
(b) flow soldering the component and the screw onto the board;
(c) cooling down the component and the board to a predetermined temperature; and
(d) screwing the component onto the board using remaining screws to secure the component to the board, after the component
and the board have been cooled down to the predetermined temperature.
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