US 7,492,593 B2
Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow
Levi A. Campbell, Poughkeepsie, N.Y. (US); Richard C. Chu, Hopewell Junction, N.Y. (US); Michael J. Ellsworth, Jr., Lagrangeville, N.Y. (US); Madhusudan K. Iyengar, Woodstock, N.Y. (US); Roger R. Schmidt, Poughkeepsie, N.Y. (US); and Robert E. Simons, Poughkeepsie, N.Y. (US)
Assigned to International Business Machines Corporation, Armonk, N.Y. (US)
Filed on Mar. 17, 2008, as Appl. No. 12/49,632.
Application 12/049632 is a continuation of application No. 11/467245, filed on Aug. 25, 2006, granted, now 7,397,661.
Prior Publication US 2008/0158815 A1, Jul. 03, 2008
Int. Cl. H05K 7/20 (2006.01)
U.S. Cl. 361—696  [361/690; 361/695; 165/104.33; 174/16.1; 454/184] 16 Claims
OG exemplary drawing
 
1. A cooled electronics system comprising:
a frame including at least one electronics drawer containing at least one electronics component to be cooled, the frame having a front with an air inlet and a back with an air outlet for the ingress and egress of air flow across the at least one electronics drawer;
a cabinet encasing the frame, the cabinet comprising a front cover spaced from and positioned over the air inlet in the front of the frame, a back cover spaced from and positioned over the air outlet in the back of the frame, a first side air return at a first side of the frame and a second side air return at a second side of the frame;
an air moving device for moving air within the cabinet encasing the frame, the air moving device establishing air flow across the at least one electronics drawer, wherein with egress through the air outlet of the frame, the air flow bifurcates at the back cover and returns to the air inlet of the frame via the first side air return, the second side air return and the front cover of the cabinet; and
at least one air-to-liquid heat exchanger disposed within at least one of the cabinet and the frame for facilitating cooling of the air flow across the at least one electronics drawer, and hence cooling of the at least one electronics component.