| US 7,492,502 B2 | ||
| Method of fabricating a free-standing microstructure | ||
| Clarence Chui, San Mateo, Calif. (US); and Jeffrey B. Sampsell, San Jose, Calif. (US) | ||
| Assigned to IDC, LLC, San Francisco, Calif. (US) | ||
| Filed on Aug. 05, 2005, as Appl. No. 11/198,127. | ||
| Claims priority of provisional application 60/613299, filed on Sep. 27, 2004. | ||
| Prior Publication US 2006/0077529 A1, Apr. 13, 2006 | ||
| Int. Cl. G02B 26/00 (2006.01); G02B 26/08 (2006.01); G02F 1/29 (2006.01) | ||
| U.S. Cl. 359—291 [359/290; 359/292; 359/298] | 17 Claims |
| 1. A method for fabricating a microelectromechanical systems device comprising:
forming a conductive layer over a first sacrificial layer;
patterning a movable conductor from the conductive layer;
forming a planar layer of a second sacrificial layer over the movable conductor and first sacrificial layer;
forming an opening in the first sacrificial layer prior to forming the second sacrificial layer, wherein the opening is adjacent
to the movable conductor;
forming a first opening in the second sacrificial layer, wherein
the first opening in the second sacrificial layer is adjacent to the movable conductor; and
the first opening in the second sacrificial layer is substantially aligned with the opening in the first sacrificial layer;
and
forming a deformable layer over the second sacrificial layer, and into the first opening in the second sacrificial layer,
thereby forming an integrated deformable layer and post.
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