| US 7,491,978 B2 | ||
| Light emitting diode package | ||
| Alexander L'Vovich Zakgeym, St.-Petersburg (Russian Federation); Seog Moon Choi, Seoul (Korea, Republic of); and Sung Jun Lee, Seoul (Korea, Republic of) | ||
| Assigned to Samsung Electro-Mechanics Co., Ltd., Kyungki-Do (Korea, Republic of) | ||
| Filed on Jul. 26, 2006, as Appl. No. 11/492,754. | ||
| Claims priority of application No. 2005123795 (RU), filed on Jul. 26, 2005. | ||
| Prior Publication US 2007/0023776 A1, Feb. 01, 2007 | ||
| Int. Cl. H01L 33/00 (2006.01) | ||
| U.S. Cl. 257—98 [257/E33.056] | 7 Claims |
| 1. A light emitting diode package, comprising:
a submount substrate including a main cavity defined as a mounting region and having side walls inclined upwardly, first and
second assistant cavities formed around the main cavity, and first and second grooves extending between the main cavity and
the first and second assistant cavities on an upper surface of the submount;
first and second bump pads formed on a bottom surface of the main cavity;
first and second bonding pads formed on a bottom surface of the first and second assistant cavities, respectively;
first and second conductive lines formed along a bottom surface of the first and second grooves for connecting the first and
second bump pads to the first and second bonding pads, respectively; and
a light emitting diode mounted on the main cavity so as to be connected to the first and second bump pads.
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