US 7,491,967 B2
Field effect transistor, method of producing the same, and method of producing laminated member
Daisuke Miura, Numazu (Japan); Tomonari Nakayama, Yokohama (Japan); Toshinobu Ohnishi, Yokohama (Japan); Makoto Kubota, Kawasaki (Japan); Akane Masumoto, Yokohama (Japan); Hidetoshi Tsuzuki, Kawasaki (Japan); and Makiko Miyachi, Kawasaki (Japan)
Assigned to Canon Kabushiki Kaisha, Tokyo (Japan)
Appl. No. 10/555,614
PCT Filed Mar. 09, 2005, PCT No. PCT/JP2005/004586
§ 371(c)(1), (2), (4) Date Nov. 04, 2005,
PCT Pub. No. WO2005/086254, PCT Pub. Date Sep. 15, 2005.
Claims priority of application No. 2004-067671 (JP), filed on Mar. 10, 2004.
Prior Publication US 2007/0012914 A1, Jan. 18, 2007
Int. Cl. H01L 51/00 (2006.01); H01L 51/05 (2006.01)
U.S. Cl. 257—40  [257/642; 257/E51.007; 257/E51.005; 438/99] 4 Claims
OG exemplary drawing
 
1. A field effect transistor having an organic semiconductor layer, comprising:
an organic semiconductor layer containing at least porphyrin; and
a layer composed of at least a polysiloxane compound, the layer being laminated on the organic semiconductor layer so as to be in intimate contact with the organic semiconductor layer,
wherein Bragg angles (2θ) of CuKα X-ray diffraction in the organic semiconductor layer have peaks at 8.3°±0.2°, 10.1°±0.2°, 11.8°±0.2°, and 14.4°±0.2°.