| US 7,491,965 B2 | ||
| Heat-shielded low power PCM-based reprogrammable eFUSE device | ||
| James P. Doyle, Bronx, N.Y. (US); Bruce G. Elmegreen, Golden Bridge, N.Y. (US); Lia Krusin-Elbaum, Dobbs Ferry, N.Y. (US); Chung Hon Lam, Peekskill, N.Y. (US); Xiao Hu Liu, Briarcliff Manor, N.Y. (US); Dennis M. Newns, Yorktown Heights, N.Y. (US); and Christy S. Tyberg, Mahopac, N.Y. (US) | ||
| Assigned to International Business Machines Corporation, Armonk, N.Y. (US) | ||
| Filed on May 28, 2008, as Appl. No. 12/127,994. | ||
| Application 12/127994 is a continuation of application No. 11/467294, filed on Aug. 25, 2006. | ||
| Prior Publication US 2008/0224118 A1, Sep. 18, 2008 | ||
| This patent is subject to a terminal disclaimer. | ||
| Int. Cl. H01L 47/00 (2006.01) | ||
| U.S. Cl. 257—4 [257/209; 257/529; 257/E29.17] | 17 Claims |
| 1. An electrically re-programmable fuse (eFUSE) device for use in integrated circuit devices, comprising:
an elongated heater element;
an electrically insulating liner surrounding an outer surface of the elongated heater element, corresponding to a longitudinal
axis thereof, leaving opposing ends of the elongated heater element in electrical contact with first and second heater electrodes;
a phase change material (PCM) surrounding a portion of an outer surface of the electrically insulating liner;
a thermally and electrically insulating layer surrounding an outer surface of the PCM; and
first and second fuse electrodes in electrical contact with opposing ends of the PCM;
wherein the PCM is encapsulated within the electrically insulating liner, the thermally and electrically insulating layer,
and the first and second fuse electrodes.
|