| US 7,491,910 B2 | ||
| Hardfacing electrode | ||
| Ashish Kapoor, Highland Heights, Ohio (US); Teresa Melfi, Kirtland, Ohio (US); and Damian Kotecki, Mentor, Ohio (US) | ||
| Assigned to Lincoln Global, Inc., City of Industry, Calif. (US) | ||
| Filed on Mar. 22, 2006, as Appl. No. 11/387,025. | ||
| Application 11/387025 is a continuation in part of application No. 11/041815, filed on Jan. 24, 2005. | ||
| Prior Publication US 2006/0165552 A1, Jul. 27, 2006 | ||
| Int. Cl. B23K 35/04 (2006.01); B23K 35/22 (2006.01); B23K 35/34 (2006.01) | ||
| U.S. Cl. 219—146.23 [219/145.1; 219/145.22; 219/146.1; 219/146.32; 219/146.52] | 21 Claims |
1. An electrode for forming a hardfacing alloy for application to a metal surface, said electrode including iron, at least
0.05 weight percent by electrode vanadium and over 0.1 weight percent by electrode niobium, said hardfacing alloy comprising
of at least about 7 weight percent chromium, at least about 0.02 weight percent nitrogen, metal sensitization inhibitor, and
a majority weight percent iron, said hardfacing alloy containing less than about 6% ferrite, said metal sensitization inhibitor
in said hardfacing alloy including a metal selected from the group consisting of at least about 0.3% niobium, at least about
0.05% vanadium, and combinations thereof, said electrode including a metal sheath and a fill composition said fill composition
comprising by weight percent of said total electrode:
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