US 7,491,909 B2
	Pulsed laser processing with controlled thermal and physical alterations
Tadashi Yamamoto, Fremont, Calif. (US); Donald J. Harter, Ann Arbor, Mich. (US); Rajesh S. Patel, Fremont, Calif. (US); and Alan Y. Arai, Fremont, Calif. (US)
Assigned to IMRA America, Inc., Ann Arbor, Mich. (US)
Filed on Mar. 31, 2004, as Appl. No. 10/813,389.
Prior Publication US 2005/0218122 A1, Oct. 06, 2005
Int. Cl. B23K 26/38 (2006.01)

U.S. Cl. 219—121.61  [219/121.68; 219/121.69]

56 Claims

1. A method of materials processing, wherein the method comprises applying bursts of laser light to a target area of a material at a predetermined repetition rate, the burst of laser light comprising at least first and second pulses of laser light displaced or overlapped in time, wherein the first pulse has a first pulse width and the second pulse has a second pulse width, and the first pulse width is greater than the second pulse width, the second pulse width being about 1 picosecond or shorter, the first pulse further comprising a pedestal having sufficient energy to at least thermally heat the target area of the material.