US 7,491,902 B2
Electromagnetic wave shielding film and method for producing the same
Nobuo Naito, Tokyo-To (Japan); Fumihiro Arakawa, Tokyo-To (Japan); and Tadahiro Masaki, Tokyo-To (Japan)
Assigned to Dai Nippon Printing Co., Ltd., Tokyo (Japan)
Appl. No. 10/580,414
PCT Filed Jan. 20, 2005, PCT No. PCT/JP2005/000644
§ 371(c)(1), (2), (4) Date May 23, 2006,
PCT Pub. No. WO2005/072040, PCT Pub. Date Aug. 04, 2005.
Claims priority of application No. 2004-012526 (JP), filed on Jan. 21, 2004.
Prior Publication US 2007/0181326 A1, Aug. 09, 2007
Int. Cl. H05K 9/00 (2006.01)
U.S. Cl. 174—389  [174/392; 313/313] 7 Claims
OG exemplary drawing
 
1. An electromagnetic wave shielding sheet comprising:
a transparent substrate,
a metal mesh layer laminated to one surface of the transparent substrate with an adhesive layer,
a first blackening layer containing copper being formed on one face of the metal mesh layer on a side of the transparent substrate, and a second anticorrosive layer containing one or more metals selected from chromium, nickel, and silicon being formed on a other face of the metal mesh layer on a side opposite to the transparent substrate, and
a second blackening layer fully covering side faces of the first blackening layer, the metal layer, and the second anticorrosive layer that are on the transparent substrate, and a front face of the second anticorrosive layer.