| US 7,491,895 B2 | ||
| Wiring substrate and method of fabricating the same | ||
| Ryosuke Usui, Ichinomiya (Japan); and Takeshi Nakamura, Isesaki (Japan) | ||
| Assigned to Sanyo Electric Co., Ltd., Osaka (Japan) | ||
| Filed on May 26, 2005, as Appl. No. 11/140,304. | ||
| Claims priority of application No. 2004-159802 (JP), filed on May 28, 2004. | ||
| Prior Publication US 2005/0266214 A1, Dec. 01, 2005 | ||
| Int. Cl. H01L 23/48 (2006.01) | ||
| U.S. Cl. 174—262 [174/257; 174/264; 174/265; 257/774] | 13 Claims |
| 1. A wiring substrate comprising:
a substrate; and
wiring that fills a recess in the substrate, wherein
the wiring comprises a first metal film that covers the side wall of the recess, a metal oxide film that covers the first
metal film, and a second metal film on the metal oxide film.
|