| US 7,491,894 B2 | ||
| Hybrid integrated circuit device | ||
| Takeshi Suzuki, Gunma (Japan); Toshiyuki Ilmura, Saitama (Japan); Kazushige Osumi, Gunma (Japan); and Shinichi Tsuyuki, Gunma (Japan) | ||
| Assigned to Sanyo Electric Co., Ltd., Osaka (Japan) | ||
| Filed on Mar. 21, 2005, as Appl. No. 11/85,342. | ||
| Claims priority of application No. P2004-089495 (JP), filed on Mar. 25, 2004. | ||
| Prior Publication US 2005/0213308 A1, Sep. 29, 2005 | ||
| Int. Cl. H05K 1/16 (2006.01) | ||
| U.S. Cl. 174—260 [257/735] | 17 Claims |
| 1. A hybrid integrated circuit device comprising:
a metal circuit board and a first surface of the circuit board being covered with an insulating layer;
a conductive pattern formed on the insulating layer wherein the conductive pattern includes pads on two opposite edges of
the circuit board;
circuit elements positioned on and electrically connected to the conductive pattern to provide an electric circuit of the
hybrid integrated circuit device;
a plurality of leads each having a first end portion fixed to the pads;
a sealing resin covering the circuit elements and the connection part of the pad and lead; and
a second surface of the metal circuit board being not covered by the sealing resin;
wherein the hybrid integrated circuit device is surface-mounted on a mount board using the leads, of which second end portions
are fixed on a conducting path formed on the mount board and wherein the first surface is facing towards the mount board and
the second surface is facing away from the mount board, and
wherein a circuit element is on a surface of the mount board in a region corresponding to a place under the circuit board.
|