| US 7,491,893 B2 | ||
| Mounting substrate and mounting method of electronic part | ||
| Masakazu Takesue, Kawasaki (Japan) | ||
| Assigned to Fujitsu Limited, Kawasaki (Japan) | ||
| Filed on Sep. 13, 2004, as Appl. No. 10/938,517. | ||
| Claims priority of application No. 2004-118203 (JP), filed on Apr. 13, 2004. | ||
| Prior Publication US 2005/0224560 A1, Oct. 13, 2005 | ||
| Int. Cl. H05K 1/16 (2006.01) | ||
| U.S. Cl. 174—260 [174/261; 361/772] | 14 Claims |
| 1. A mounting substrate, comprising:
a land connected to an electrode of an electronic part by a melt-capable connection member; and
a connection member flow-generation part configured to generate a flow at the molten melt-capable connection member,
wherein the connection member flow-generation part is made of metal and is provided at a substantially center part on the
land so as to project upward.
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