US 7,491,308 B2
Method of making rolling electrical contact to wafer front surface
Homayoun Talieh, San Jose, Calif. (US); Cyprian Uzoh, San Jose, Calif. (US); and Bulent M. Basol, Manhattan Beach, Calif. (US)
Assigned to Novellus Systems, Inc., San Jose, Calif. (US)
Filed on May 05, 2005, as Appl. No. 11/123,268.
Application 11/123268 is a continuation of application No. 10/826219, filed on Apr. 16, 2004, granted, now 7,311,811.
Application 10/826219 is a continuation of application No. 10/459320, filed on Jun. 10, 2003, granted, now 7,282,124.
Application 10/459320 is a continuation of application No. 10/459321, filed on Jun. 10, 2003, granted, now 7,309,413.
Application 10/459321 is a continuation of application No. 10/459323, filed on Jun. 10, 2003, granted, now 7,329,335.
Application 10/459323 is a continuation of application No. 10/302213, filed on Nov. 22, 2002, abandoned.
Application 10/302213 is a continuation of application No. 09/685934, filed on Oct. 11, 2000, granted, now 6,497,800.
Claims priority of provisional application 60/190023, filed on Mar. 17, 2000.
Prior Publication US 2005/0269212 A1, Dec. 08, 2005
Int. Cl. C25D 5/00 (2006.01); C25B 9/00 (2006.01)
U.S. Cl. 205—137  [205/93; 204/242] 19 Claims
OG exemplary drawing
 
1. A method of conducting electricity to a surface of a semiconductor wafer using a movable contact during an electrochemical process, the method comprising:
contacting the movable contact to the surface; and
moving at least one of the movable contact and the wafer to cause the movable contact to roll on the surface in a plurality of directions while conducting electricity to the surface during the electrochemical process.