	US 7,491,290 B2
	Two-pack type adhesive
Takayuki Matsushima, Tochigi (Japan); and Masao Saito, Tochigi (Japan)
Assigned to Sony Chemical & Information Device Corporation, Tokyo (Japan)
Appl. No. 10/505,489 PCT Filed Feb. 14, 2003, PCT No. PCT/JP03/01593 § 371(c)(1), (2), (4) Date Aug. 20, 2004, PCT Pub. No. WO03/070850, PCT Pub. Date Aug. 28, 2003.
Claims priority of application No. 2002-044240 (JP), filed on Feb. 21, 2002.
Prior Publication US 2005/0096432 A1, May 05, 2005
Int. Cl. C09J 163/00 (2006.01); B32B 27/38 (2006.01)

U.S. Cl. 156—310 [156/330; 428/413; 428/414; 525/523; 528/92]

12 Claims

5. A method for producing a continuously connected member, comprising:

forming a two-component anisotropic electrically conductive adhesive film by coating on release films a first adhesive material and a second adhesive material to yield a sheet form of the first adhesive material and a sheet form of the second adhesive material, respectively; and

heating and pressing to each other the first and second adhesive materials to form said continuously connected member,

wherein the first adhesive material is obtained by adding a first curing agent to a first resin component, and the second adhesive material is obtained by adding a second curing agent to a second resin component, at least one of said first and second adhesive materials having electrically conductive particles added thereto,

wherein said first and second resin components are formed of an epoxy resin;

wherein one of said first and second curing agents is composed of a silane coupling agent, with the other curing agent being composed of one or both of aluminum chelate and aluminum alcoholate that react with said silane coupling agent to yield cations; and

wherein during the heating and pressurizing, said first and second adhesive materials are contacted and mixed with each other to react with each other to cause a chain reaction of said cations to cause polymerization of said first and second resin components by said cations.